PCD&F December 2009 cover

FEATURES

  • IPC-2152
    Determining Current Carrying Capacity
    Charts from some 50 years ago to predict conductor heat loss and temperature rise finally have been updated. How to use the new standard.
    by Jack Olson

  • Conductor Resistance
    The Skinny on Skin Effect
    The tendency for a conductor to become a function of frequency impacts its impedance. For those designing controlled impedance traces and transmission lines, this merits consideration.
    by Douglas Brooks, Ph.D.

FIRST PERSON

  • Caveat Lector
    Productronica productive, foretelling.
    Mike Buetow

  • Database
    Designer visibility.
    Pete Waddell

MONEY MATTERS

  • ROI
    One size doesn't fit all.
    Peter Bigelow

TECH TALK

 

DEPARTMENTS

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PCD&F November 2009 cover

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FEATURES

NANOTECHNOLOGY
Nanotechnology and Electronics Developments
Is nanotechnology living up to its promises? What is the reality - which products are out there, how do we need to handle them and what are the benefits?
by Alan Rae

ONE ON ONE
'Engineering is No. 1'
In a recent interview, Multek's president, Werner Widmann, explains why he sees value in diversification.
by Mike Buetow

IMPEDANCE CONTROL
Accurate Impedance Control, Part I
How to calculate PCB trace width and differential pair separation, based on the impedance requirement and other parameters.
by Istvan Nagy

DESIGN FOR RELIABILITY
Failure Mechanisms in Lead-Free Laminates
The risks of via failure must be balanced against those of laminate failure, based on material choice, via size and grid, and other factors.
by Kevin Knadle

 

POINT OF VIEW

Database
Assessing the Mentor-Valor deal.
Pete Waddell

ROI
What are the four fundamental areas every successful business plan should address?
Peter Bigelow

Reliability Report
The stress of x- and y-axis flexing can affect the integrity of internal interconnections.
Paul Reid

Designer's Notebook
As its complexity increases, the challenge of implementing an FPGA on a printed circuit board has become a daunting task.
Per Viklund

 

DEPARTMENTS

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PCD&F October 2009 cover

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FEATURES

PCB DESIGN GRID
A Universal PCB Design Grid System
Metric is the key to a gridded system.
by Tom Hausherr

iNEMI ROADMAP
Keeping Connected
Connector technology still grapples with smaller platforms, higher speeds and placement issues.
by John MacWilliams

EMBEDDED MATERIALS
Embedded Passives: Debut in Prime Time
Wherever there is a strong need for improved electrical performance, space reduction, EMI reduction or reliability improvement, utilization of embedded passives will be found.
by Joel S. Peiffer

 

POINT OF VIEW

Database
Full circle.
Pete Waddell

ROI
Industry forces enable the highest cutting-edge technology but can end up at odds over the day-to-day minutia of business.
Peter Bigelow

Final Finish 101
The best surface finish meets the needs of the board design and the assembly process, while being easy on the wallet.
Jim Kenny

Positive Plating
Surface roughness can originate from a number of sources; imbalances in the organic additives and improper filming of the copper anodes are key contributors.
Michael Carano

Designer's Notebook
Rigid-flex circuits combine the best of both worlds.
Happy Holden

 

DEPARTMENTS

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PC&D&F September 2009 cover

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FEATURES

Simulation
Power Integrity: Controlling the Noise
Coupling SI and PI simulation generates a reliable prediction of signal-dependent PDN noise that can be used to predict board-level emissions under actual operating conditions.
by Brad Brim

Education
Tips on Building a Signal Integrity Team
The demand for signal integrity engineers is on the rise, but universities have made slow progress in training for today's power and signal integrity challenges.
by Hal Katircioglu

 

POINT OF VIEW

Our Line
Designing the engineer.
Kathy Nargi-Toth

ROI
Incorrect assumptions put a strain on the entire supply chain.
Peter Bigelow

Reliability Report
Reliability is a balance between force and strength, and when the force is greater than the strength of the copper and dielectric material, the PCB fails.
Paul Reid

On the Forefront
Driven by production adoption, happy days are here at last.
E. Jan Vardaman

Designer's Notebook
The proper design of the power distribution network, coupled analysis in the early design phases, can eliminate most power integrity issues.
Patrick Carrier

 

DEPARTMENTS

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August 2009 PCD&F Cover

FEATURES

Thermal Management
Fluid Dynamic Simulation for Cool Design
Computational fluid dynamics-based simulations that examine temperature and heat flux can help engineers make better thermal management decisions.
by Robin Bornoff

Supply Chain
Redefining the Role of BOM
Today’s BOM is a roadmap of the engineer’s design intent up and down the manufacturing supply chain.
by Nolan Johnson

Plating
Electroplating for HDI and Packaging Substrates, Part 1
Process chemistry, substrate condition, mass transport and current density have a significant impact on via-filling capability.
by Mark Lefebvre, Elie Najjar, Luis Gomez and Leon Barstad

iNEMI Roadmap
Information Management Gaps for Board Fabrication and Assembly
The progress toward complete data packages has been slow.
by Eric Simmon

 

POINT OF VIEW

Our Line
A cool spin.
Kathy Nargi-Toth

ROI
In the electronics industry, technology leadership is key to customer satisfaction.
Peter Bigelow

Reliability Report
Slow increases in resistance during the testing suggest metal fatigue, or wear-out failure, a common failure mode for robust PCBs.
Paul Reid

Interconnect Strategies
VNA is a powerful tool for determining DUT response in frequency domain, but accuracy is influenced by external factors.
Dr. Abe Riazi

Designer's Notebook
How to increase overall coverage while decreasing the number of physical test points that need to be added to a design.
Mark Laing

 

DEPARTMENTS

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