Opening Eyes on Fiber Weave and CAF
New glass fabrics that can reduce the glass weave to signal line interaction will help designers meet the tighter skew specifications needed for high-speed applications. These materials also demonstrate an improved resistance to CAF formation.
by Russell Dudek, John Kuhn and Patricia Goldman
Near-Term Opportunities for Large-Area Flexible Electronics
Large area flexible electronics will cause a paradigm shift in electronics. Photovoltaics, displays and sensors offer an attractive alternative to “business as usual” electronics manufacturing.
by Daniel Gamota
Concurrent RF/Microwave PCB Design
When RF and PCB design teams are perceived and treated as equals, the design itself wins by achieving its performance goals in less time, with fewer headaches and increased market success.
by Dr. Michael C. Heimlich and Per Viklund
Designing with MicroBGAs
MicroBGAs provide electrical and physical advantages such as better chip delay performance, but the cost of implementation includes increased design and manufacturing complexity.
by Ishtiaq Safdar
America's Next Model?
New Opportunities in Electronics Manufacturing
Implementing MEMS, HDI and embedded components requires significant investment and a change in the way the factory floor is run, but it could mean more stable business relationships, technology partnerships and significantly improved margins and yields.
by Matthew Holzmann
Processing High Frequency Materials, Parts 1 and 2
The electrical benefits of high frequency materials are well understood, but PCB fabrication of these materials can be challenging. Understanding the distinct process requirements of high frequency materials can increase yields and improve product reliably.
by John Coonrod
POINT OF VIEW
Uncertainty is a big distracter, so keep staff focused on standard procedures and process controls to avoid costly mistakes.
Final Finish Forum
The judgment on what defines an ideal PCB surface finish varies greatly depending on the vantage point of the judge.
When designing a PCB stackup, get the fabricator involved.
Dr. Abe (Abbas) Riazi
To identify weak microvias with the potential for field failure, ISt test temperatures need to be increased and cycling extended to failure.
Complex power distribution network design requires accurate analysis tools.
Off the Shelf