PCDF December cover

FEATURES

Co-Design
Electronic System Design
ECAD-MCAD collaboration supports bidirectional communication that can shorten design times, reduce errors and bring competitive products to market faster.
by John Isaac

Design Basics
Data Management 101
When data management is an integral part of the design environment, it works with designers rather than against them.
by Rob Evans

Salary Survey
Designers Take on Technology challenges in 2008
The decisions made in the design seat determine not only the size and shape of the PCB, but also the technology and materials needed to build it.
by Kathy Nargi-Toth

System Design
PCB Signal Integrity, Power Integrity and EMC Challenges
System-level PCB emission analysis reduces re-spins and EMC issues when PCBs are incorporated into larger systems.
by Brad Brim

Regulation Update
What’s in a Name?
The roles WEEE, RoHS and REACH play in the environment.
by Margo Lakin

HS Laminates
PCB Dielectric Materials for High-Speed Applications
The glass weave in a laminate can affect propagation velocity and loss profile, leading to signal loss and skew in differential pairs.
by Ravindra Gali

POINT OF VIEW

Our Line
Narrowing the gap.
Kathy Nargi-Toth

ROI
Providing great customer service can bring success in tough economic times.
Peter Bigelow

Global Sourcing
A proposed QMl will cost OEMs and suppliers more – and won’t solve the target problem.
Greg Papandrew

EMC for the Real World
Knowing the ins and outs of EMC software tools can save time and money.
Dr. Bruce Archambeault

Interconnect Strategies
Stackup analysis can help to optimize layer count, trace width, spacing and electrical performance.
Dr. Abe (Abbas) Riazi

On the Forefront
In the area of basic research, who will play? And who will pay?
E. Jan Vardaman

Final Finish Forum
ENEPIG is a unique surface finish that exhibits improved solder joint reliability when it is used with lead-free SAC alloys.
George Milad

Test and Inspection
How a grassroots organization can help get managers on board.
Stacy Kalisz Johnson

BGA Bulletin
Fine-pitch BGAs dramatically increase in pin count and will drive adoption of HDI.
Charles Pfeil

DEPARTMENTS

Interactive Ad Index

Off the Shelf

November 2008 Cover

FEATURES

DfM Basics
Ten Tips to Improve Manufacturability
It’s as simple as doing it right the first time.
by Arbel Nissan

System Modeling
3D Chip-Package-Board Modeling
Advanced computing languages will help to develop flexible solver architectures and efficient simulation methods.
by Vikram Jandhyala, Dipanjan Gope, Swagato Chakraborty, Feng Ling, Xiren Wang, Devan Williams And James Pingenot

Measurement and Simulation
Improving Circuit Simulation With The Addition Of Real Measurements
Real measurements allow the engineer to proactively improve the design, saving time and money.
by Bhavesh Mistry

From the Field
PCB West: Interview with NBS Design Inc.
Craig Arcuri talks about the company credo – passion, quality and speed – which translates into end product perfection.
by Kathy Nargi-Toth

Lead-Free Reliability
The Influence of Final Finish on Lead-Free Assembly Reliability
Understanding the end use application of a PCB is critical in the selection of right solderable final finish for Pb-free applications.
by Mohammad Hossain, Nikhil Lakhkar, Puligandla Viswanadham and Dereje Agonafer

Solder Resists
The Lead-free Soldering Challenges for Peelable Resists
The appeal of peelable resist technology.
by Ian McDonald

POINT OF VIEW

Our Line
Improving the bottom line.
Kathy Nargi-Toth

ROI
Tough times call for cooperation across the supply chain.
Peter Bigelow

Positive Plating
Anode-cathode placement and secondary current distribution.
Michael Carano

BGA Bulletin
Any-layer vias can be stacked to span any set of layers.
Charles Pfeil

DEPARTMENTS

Interactive Ad Index

Off the Shelf

October 2008 cover

Read more: October 2008 Issue

PCD&F September 2008 Cover

Read more: September 2008 Issue

PCDF August 2008 cover

Read more: August 2008 Issue
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