Printed Circuit Design & Fab Online Magazine - Products

New Products

DuPont introduces Pyralux APR copper clad resistor laminate. The product is a double-sided construction of polyimide film bonded to copper foil and used in advanced multi-layer flex, rigid flex and rigid PCBs. It features Ticer Technologies TCR thin film copper resistor foil as one or both of the clad foils.

Available in a range of dielectric thicknesses and resistance levels, the laminate provides a variety of circuit constructions. It is compatible with printed wiring board processes and has a thermal resistance up to 180° C.

Having embedded capacitance and resistance, the product is reported to have excellent dielectric thickness tolerance and electrical performance. It is also IPC 4204/11 certified.

www.pyralux.dupont.com

Murata Power Solutions introduces the HPQ series, ultra-high power quarter brick isolated DC/DC converter.

The product has a voltage output range of 36 VDC to 75 VDC and basic insulation up to 2250 V. Fixed output voltage is regulated to within ±1% and can be trimmed to within ±10% of nominal output.

The module has a 3.3 VDC fixed output. With an output current of up to 50 A, it can provide as much as 165 W of power. Designed for PCB mounting, the module is suitable for use across -40° C to 85° C. An optional baseplate is available.

www.murata-ps.com

JD Photo-Tools introduces GerbTool scripts, a set of automated scripts that run within GerbTool/VisualCAM suites of software.

The scripts are automated macro programs designed to run within the GerbTool shell. Users can create off-line programming from data sets, increasing PCB assembly productivity. Included is a Component Edit facility that allows users to search, find and highlight components on screen.

The product can be configured to match existing format requirements and supports metric and imperial codes. VisualCAM users can use the scripts as an entry-level alternative to powerful ARE modules that allow SMT/BOM capabilities.

www.jdphoto.co.uk

Mentor Graphics has released a power integrity analysis tool, HyperLynx PI, which according to the company provides easy-to-learn-and-use setup and accurate analysis of power plane structures.

Targeting the design of high-performance electronic products, HyperLynx can assist design teams in the optimization of the working power delivery system. To address high density/pin-count ICs, the power delivery system analysis tool analyzes the design, ensuring that clean, sufficient power is delivered to the ICs through multiple PCB power and ground structures.

The HyperLynx product provides analysis that is both visual and textual, allowing the designer to identify and resolve issues. The analysis tool can provide accurate analysis of the power integrity, enabling designers to determine the best number, placement and values of the de-coupling capacitors. PI analysis facilitates designers experimenting with PCB fabrication materials and stack-up when determining the best electrical and cost solutions, allowing designers to optimize the performance of advanced designs while avoiding the need of costly prototypes and re-spins.

www.mentor.com

USA Technical Machine Products introduces the Eco-Lab Press. The hydraulic press uses less energy to cool platens during press temperature cycling.

A multi-stage cooling process employs forced air to initially cool the platens. After the product reaches 500° F, it is transferred to a cold press. Sweating is eliminated and water usage reduced because water flows only to the cold press platens when needed.

The press has a temperature control accuracy of ±0.25% and a platen temperature uniformity of ±2.5% of set point. The control system includes a 12-point paperless recorder and complies to all NEC, NFPA 70E and NFPA 79 codes.

www.techmach.com

Molex Inc., in conjunction with Neoconix, introduces the Molex FlexBeam Tool-Less Copper Flex Interposer. The high-speed, copper flex assembly from Molex joins Neoconix’s HD&S PCBeam interposer to provide high-density interface for flex-to-PCBA applications.

The product is a low profile, flex-to-board interface providing densities of 1.00 mm or less in numerous pin-matrix configurations. A z-axis is added to traditional 2D PCB processing through all-metal spring beams permanently embedded onto an FR-4 substrate.

With photolithography and etch-based processes, the interposer provides dimensional control that is scalable to very fine feature sizes for applications having space constraints. The integrated copper flex assembly enables signal speeds greater than 10 Gbps and single-ended speed of 4 GHz and higher.

Users can achieve board-to-flex pin counts of 500 input/outputs or greater, and a dual-beam option is available for contact redundancy in high-reliability applications.

www.molex.com