RBP Chemical Technology Inc. introduces MetalTreat 530, MetalTreat 4007 and MetalTreat 957, a waste treatment process for electronics and metal finishing. MetalTreat 530 precipitates metals out of solution, and MetalTreat 4007 coagulates the waste metal. This metal waste is then flocculated by MetalTreat 957. This three-step process produces a solid waste cake that can be easily removed from the bath. The chemicals are non-DOT regulated and non-hazardous. MetalTreat 530 is free DTC, preventing aquatic toxicity. It can also be used with ORP metering. MetalTreat 957 is packaged in suspension, providing easy handling. MetalTreat 4007 is effective in both PCB and metal finishing applications. www.rbpchemical.net
3M introduces an Ultra Hard Metric (UHM) socket connector, providing multi-Gigabit performance to hard-metric, compact PCI, VME and PXI systems.
The socket connector is reported to deliver more than 7 Gbps of backplane performance for systems based on 2-mm, hard-metric connectors. Users can increase overall system performance while maintaining existing investments.
Able to mate with both industry-standard and 2-mm, hard-metric header connectors, the socket provides design flexibility for engineers and supports 100 ohm differential pairs in rows or columns. Five-row (A, B, CL, CR, AB) and eight-row (D, E, DE, FL, FR) form factors are available for high signal density.
Teknek introduces Nanocleen, an advanced cleaning system for the electronics industry. Features include a unique polymer roller capable of removing particles down to 25 nm in size. The high performance roller is reported to remove 25% to 50% more particles than other contact cleaners. Both the adhesive roll and roller are 100% silicon free, and when compared to traditional contact cleaners, static is reduced by a factor of 10. An optional kit allows Nanocleen to be fitted to other makes and models of cleaning machines.
Elprinta introduces a thermally conductive adhesive for insulated metal substrate (IMS) boards. The cut-to-PCB adhesive is reported to withstand heat and resist mechanical PCB processes. The product bonds the PCB directly to the target surface, eliminating the need for mechanical fasteners. Manufacturers no longer need to cut and paste thermal tapes after board assembly. www.elprinta.com
Zuken introduces the Board Modeler. The collaborative software tool docks into Zuken’s electronic systems and CR-5000 PCB design suite, enabling layout and mechanical engineers to work together. Users are able to work in a 3D environment, showing the actual component shape rather than an approximation. Board outlines, pre-placed parts and obstacles can be imprinted directly from mechanical CAD tools, eliminating duplicate work. Board layout structures can be exported into numerical simulation tools for mechanical, electrical or thermal verification. Simulation results can be back annotated into CR-5000 tools for design modifications. In addition, a multi-board option allows multiple-board design verification and chassis on a multi-site global basis. www.zuken.com
The 2009 release of Advanced Design System (ADS) from Agilent Technologies Inc. is a high-frequency/high-speed co-design tool for integrated circuits (IC), packages and PCBs.
ADS provides circuit, package, board and system designers with a single EDA platform for shared simulation models. According to the company this can minimize design rework, reduce costs and shorten delays in communications during the product design process.
The co-design platform can provide verification of high-frequency or high-speed system performance across the IC, package and printed circuit board designs using common system-verification test benches. Designers can identify and correct component interactions earlier in the design cycle.
ADS 2009 interoperates with Cadence and Mentor back-end design platforms, allowing designers to import Cadence Allegro PCB, Advanced Package Designer and System-In-Package physical design data for co-designing with active components and Design Rule Check results from Cadence Assura, Mentor Calibre or Triquint MailDRC for viewing and correcting within ADS layout environment.
The co-design models available include:
X-parameters; accurate, non-linear measurement.
3D electromagnetic parameterized components representing metal shields, antenna radomes, absorbers, packages, interconnects, finite dielectric substrates and wire bonds.
Transistor-level circuits on RFIC, MMIC, LTCC or laminate RF modules and PC boards.
Behavioral models of all types, including Verilog-A/AMS, HDL, MATLAB®, IBIS, C++ and neural networks.
Netlists from HSPICE and Spectre.
Measured signal stimulus and data from Agilent signal, network and logic analyzers.
Prebuilt simulation libraries and sources compliant with the latest wireless standards such as LTE, WiMedia and VWAN wireless HD with MIMO antenna characteristics.
