Gold-Tin Plating deposits can be selectively applied for interconnecting RF and microwave components, lead frames and other miniature parts on high-frequency PCBs.

Read more: Remtec Adapts AuSn Plating Technology for High-Frequency PCBs

InCa3D version 2.3  tool for conducter impedance and near field simulation now imports Gerber PCB CAD files, and reads both layers and vias.

Read more: Cedrat Offers InCa3D v. 2.3 Simulation Tool

MXA signal analyzer now features improved sensitivity and higher frequency stability and coverage. 

Read more: Agilent Upgrades MXA Signal Analyzer

JT 2147/VPC is signal conditional module; is a JTAG/boundary-scan hardware interface product compatible with Virginia Panel mass interconnect system.

Read more: JTAG Offers JT 2147/VPC Signal Conditional Module