RO4360G2 laminates reportedly have improved thermal reliability for higher UL max. operating temperatures. Have higher Dk of 6.15 @10GHz. Reportedly permit a 20-30% reduction in printed circuit board size. Reportedly process similar to FR-4 and are automated assembly compatible. UL 94V-0 flame rating pending; Pb-free process capable. Thermal conductivity is 0.81 W/m/K, Z-axis CTE is low, and drill performance similar to RO4350B.
UDI-8001P direct imager is said to have a throughput of 35 sec. per panel and a resolution of ±5µm lines/spaces. Overlay accuracy is reportedly ±5µm, with 600 alignment points. Processes ultra-fine-pitch flip-chip and BGA packages.
PCB Library Expert version 2013 software takes component data and automatically creates footprints and 3D models based on predefined settings. Now includes a Footprint Designer module, allowing users to create footprints for non-standard components with asymmetrical, arbitrary-style leads. Reportedly enables users to create footprints for 9 of 10 components used in a typical project. IPC now distributes the tool, along with library documentation consisting of 5,000 components. Outputs to formats readable by Allegro, OrCAD PCB, OrCAD Layout, CADint, Altium, DesignSpark, Expedition, PADS Layout, Cadstar, CR-5000, Pantheon, Pulsonix, P-CAD, Ultiboard, Target 3001!, Eagle, DipTrace and Board Station, with 3D STEP and SoloPCB in development. Library Expert Lite is free and outputs to the CAD formats mentioned above.
MB600S aqueous-based sodium silicate coating is said to provide electromagnetic interference/radio frequency interference (EMI/RFI) shielding. Is effective as aluminum reference with a range of 95-105 dB, from 100 MHz to 2 GHz, per IEEE 299, 2006 methods. Above 2 GHz, shielding effectiveness decreases to 80 dB and slightly below. Above 4 GHz, effectiveness is 60-70 dB. Is relatively non-toxic and easy to handle. Can be brushed or sprayed on. Cures at room temperature in 24 to 48 hr. or in 1 to 2 hr. at 80°C. Service temperature range 0° to 700°F.
B-724, B-727, B-728 and B-729 polyimide labels withstand harsh condition wash systems and chemicals. Are engineered to stay adhered to boards during inline and batch washes. Reportedly offer temp. performance up to 500⁰F and excellent resistance to harsh fluxing and wave solder environments. Are RoHS and Reach compliant, UL969 recognized and available in custom sizes.
Sherlock 3.0 automated design analysis software is for analyzing, grading and certifying the expected reliability of products at the circuit card assembly level. Includes a global parts database with private cloud storage; 3D FEA model and 3D viewer for ICT and shock and vibration analysis; sub-assembly analysis to attach one or more printed circuit board subassemblies to the primary circuit board; improved result management functionality, and embedded failure rate models.
