Design News

SAN JOSE, CA – Maxim Integrated Products has released a white paper examining how flexible power modules simplify power design.

Read more: Maxim Releases White Paper on Flexible Power Modules

FLAGSTAFF, AZ -- EDA market analyst Gary Smith passed away July 3 after a short bout of pneumonia.

Read more: Legendary Analyst Gary Smith Passes Away

MOUNTAIN VIEW, CA – Isola Group and Semico Research are launching the event Boards, Chips and Packaging: Designing to Maximize Results.

Read more: Isola, Semico Launch Tech Conference

SYDNEY -- Altium today announced fiscal fourth-quarter revenue of $23.87 million.

Read more: Americas Driving Altium Q4, FY15 Growth

SMYRNA, GA – PCD&F is undertaking its annual salary survey of printed circuit board designers, design engineers and other layout specialists.

Read more: PCD&F Opens Annual Designer Salary Survey

LYON, FRANCE – Fan-in wafer-level packaging is experiencing continuous growth and attracting new applications, a new research report says, due to "indisputable benefits" linked to cost and form factor.

Read more: 'Unmatched' Cost Benefit to Spur Growth of Fan-In WLPs

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