NEVADA CITY, CA -- Multichip packages are grabbing a larger share of the overall IC packaging market, and will climb to 34% of the total parts in use by 2019, based on revenue.

Overall sales of MCPs will reach $44 billion by 2019, up from $14.4 billion this year. Market share by revenue will climb four percentage points during that time, says New Ventures Research, which recently published a study on MCPs.

MCPs include a broad range of vertically stacked packages including TSOP, FBGA, QFN and WLP, as well as cimplex system-in-package devices, multichip modules (MCM), package-in-package(PiP) and package-on-package (PoP).

Fan-out wafer-level packages will increase the number of leads traditional WLPs are capable of, and are now in vilume production, with more than 10% of all WLPs including the fan-out technology, NVR said. 

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