PITTSBURGH -- Ansys has entered into a definitive merger agreement with Gear Design Solutions, a provider of big data analytics.
AUSTIN, TX -- A new research report helps dissect new component package options for split die.
ROME, NY -- Registration is open for the 37th Annual EOS/ESD Symposium, which takes place Sept. 27-Oct. 2 in Reno, NV.
ATLANTA – The exhibition floor is sold out for PCB West, the largest conference and exhibition for printed circuit board design, fabrication and assembly in the Silicon Valley, UP Media Group Inc. said today.
LYON, FRANCE – “The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore’s Law in its foundation.”
WILSONVILLE, OR -- Mentor Graphics' fiscal first-quarter net loss widened to $10.5 million from $3 million a year ago as the EDA software company aborbed the costs of a major employee restructuring.