Design News

LYON, FRANCE – Fan-in wafer-level packaging is experiencing continuous growth and attracting new applications, a new research report says, due to "indisputable benefits" linked to cost and form factor.

Read more: 'Unmatched' Cost Benefit to Spur Growth of Fan-In WLPs

SANTA ROSA, CA -- A Keysight subsidiary today announced a $600 million offer for Anite, a UK-based supplier of test and measurement tools to the wireless market.

Read more: Keysight to Buy Dutch Validation Software Co.

WESTFORD, MA – Zuken will hold a webinar on June 10 on 3D printed circuit board design in a product-centric design process.

Read more: Zuken to Hold 3D Multi-board Design Webinar Today

KATOWICE, POLAND -- Mentor Graphics has leased 48,000 sq. ft. of space in an office complex here, according to local reports.

Read more: Mentor to Add to Poland Operations

PITTSBURGH -- Ansys has entered into a definitive merger agreement with Gear Design Solutions, a provider of big data analytics.

Read more: Ansys to Acquire Big Data Analytics Firm

AUSTIN, TX -- A new research report helps dissect new component package options for split die.

Read more: New Report Sheds Light on Package 'Alphabet Soup'

Page 129 of 316