VIENNA, AUSTRIA -- AT&S has applied for a patent for a method for producing a printed circuit board consisting of at least two boards, each with an embedded component.   

CAVE CREEK, AZ -- The High Density Packaging User Group International has launched a project group focusing on printed wiring board environmental life-cycles.

AUSTIN – National Instruments offers Automated Test Outlook, a comprehensive view of key technologies and methodologies impacting the test and measurement industry.

BANNOCKBURN, IL – North American PWB shipments in December increased 13.3% year-over-year and orders rose 2.9% compared to the same month in 2009.