ESPOO, FINLAND – Aspocomp Group Plc reported strong financial improvement in 2025, with preliminary and unaudited results showing net sales rose 41% year over year to EUR 38.8 million (about $42.3 million), up from EUR 27.6 million. The company’s operating result improved by EUR 5.0 million from the prior year to a profit of EUR 1.1 million (about $1.2 million), compared with a loss of EUR 4.0 million in 2024, representing 2.8% of net sales.
BANGKOK - A Thailand government agency on Monday announced its approval of more than $2 billion in investments for new printed circuit board fabrication facilities through a joint venture of Zhen Ding Technology and Saha Pattana Interholding.
THAILAND – A global HDI printed circuit board manufacturer has launched its first production facility in Thailand, marking a significant foreign direct investment into the country’s electronics manufacturing sector.
PLANO, TEXAS – Siemens has acquired Aster Technologies, a specialist in printed circuit board assembly (PCBA) test verification and engineering software, strengthening its position in design-for-test (DfT) and manufacturing readiness for complex electronic systems.
LUXEMBOURG – Chinese copper-foil manufacturer Jiujiang Defu Technology has terminated its planned acquisition of Circuit Foil Luxembourg after the Luxembourg Ministry of the Economy imposed conditions that would have prevented Defu from gaining operational control of the business.
TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates.