Fab News

ESPOO, FINLAND – Aspocomp Group Plc reported strong financial improvement in 2025, with preliminary and unaudited results showing net sales rose 41% year over year to EUR 38.8 million (about $42.3 million), up from EUR 27.6 million. The company’s operating result improved by EUR 5.0 million from the prior year to a profit of EUR 1.1 million (about $1.2 million), compared with a loss of EUR 4.0 million in 2024, representing 2.8% of net sales.

Read more: Aspocomp Reports 41% Sales Growth

BANGKOK - A Thailand government agency on Monday announced its approval of more than $2 billion in investments for new printed circuit board fabrication facilities through a joint venture of Zhen Ding Technology and Saha Pattana Interholding.

Read more: Zhen Ding Technology to Launch Thailand JV, Add to PCB Fab Capacity

THAILAND – A global HDI printed circuit board manufacturer has launched its first production facility in Thailand, marking a significant foreign direct investment into the country’s electronics manufacturing sector.

Read more: Unitech PCB Establishes First Thailand Manufacturing Base at Singha Estate

PLANO, TEXAS – Siemens has acquired Aster Technologies, a specialist in printed circuit board assembly (PCBA) test verification and engineering software, strengthening its position in design-for-test (DfT) and manufacturing readiness for complex electronic systems.

Read more: Siemens Acquires Aster Technologies to Expand PCB Test Engineering Capabilities

LUXEMBOURG – Chinese copper-foil manufacturer Jiujiang Defu Technology has terminated its planned acquisition of Circuit Foil Luxembourg after the Luxembourg Ministry of the Economy imposed conditions that would have prevented Defu from gaining operational control of the business.

Read more: Defu Abandons Circuit Foil Luxembourg Deal

TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates.

Read more: Toppan to Add FC-BGA Manufacturing Line in January

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