Fab News

WALTHAM, MA -- Nano Dimension said it is nearing a decision on its long-term strategic direction after completing major restructuring efforts, divesting businesses and reducing operating expenses as part of a three-phase plan aimed at maximizing shareholder value.

Read more: Nano Dimension Nears End of Strategic Review, Teases Next Move

LEOBEN, AUSTRIA -- AT&S will expand production capacity for high-end AI IC substrates at its Chongqing, China, facility to support growing demand from a key customer tied to increasing AI computing requirements. The company said the investment, valued in the high double-digit million range, will be fully financed through long-term customer agreements.

Read more: AT&S Expands Chongqing Capacity for AI IC Substrates

SANTA ANA, CA – TTM Technologies reported first quarter net sales of $846 million, up 30% year over year, marking a record quarter as demand tied to AI and data center buildouts accelerated.

Read more: TTM Reports $846M Q1 Sales, Up 30% YoY

ARAYA, THAILAND – Doosan is investing approximately $135 million to establish a new production base for copper clad laminates (CCL), a key material used in printed circuit boards, as global AI infrastructure demand accelerates.

Read more: Doosan Commits $135M to Thailand PCB Materials Expansion

FREUDENSTADT, GERMANY – Schmid has introduced its Any Layer Embedded Trace (ET) process, a panel-level manufacturing platform designed to support next-generation advanced packaging as AI and high-performance computing drive increasing substrate complexity.

Read more: Schmid Launches Any Layer ET for Panel-Level Packaging

SAN JOSE, CA – Cadence reported first-quarter revenue of $1.4 billion, up from $1.2 billion year over year, driven by strong demand for AI-driven design tools and semiconductor solutions. 

Read more: Cadence Reports Q1 Revenue of Over $1B

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