FREUDENSTADT, GERMANY – Schmid has introduced its Any Layer Embedded Trace (ET) process, a panel-level manufacturing platform designed to support next-generation advanced packaging as AI and high-performance computing drive increasing substrate complexity.

The process is built as a full panel-level damascene platform for build-up layer manufacturing, enabling copper embedding within dielectric layers to support ultra-fine line structures, improved signal integrity, and enhanced power delivery. Unlike conventional modified semi-additive and semi-additive processes, the technology is designed to improve electrical performance, reliability, and surface planarity for multilayer package architectures.

The platform integrates multiple process steps, including plasma-based via and trench formation, thin-film deposition, electrochemical copper filling, and chemical mechanical polishing. It is compatible with organic, hybrid and glass core substrates, supporting applications such as advanced IC substrates, panel-level packaging, and high-density interconnect designs.

Schmid said the system is intended to enable scalable, high-volume manufacturing while maintaining process control and yield performance through single-panel handling and touchless transport architecture.

The company will also present its panel-level glass-core packaging platform at ECTC, highlighting strategies for ultra-fine redistribution layers and vertical interconnect integration.

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