Fab News

THAILAND – A global HDI printed circuit board manufacturer has launched its first production facility in Thailand, marking a significant foreign direct investment into the country’s electronics manufacturing sector.

Read more: Unitech PCB Establishes First Thailand Manufacturing Base at Singha Estate

PLANO, TEXAS – Siemens has acquired Aster Technologies, a specialist in printed circuit board assembly (PCBA) test verification and engineering software, strengthening its position in design-for-test (DfT) and manufacturing readiness for complex electronic systems.

Read more: Siemens Acquires Aster Technologies to Expand PCB Test Engineering Capabilities

LUXEMBOURG – Chinese copper-foil manufacturer Jiujiang Defu Technology has terminated its planned acquisition of Circuit Foil Luxembourg after the Luxembourg Ministry of the Economy imposed conditions that would have prevented Defu from gaining operational control of the business.

Read more: Defu Abandons Circuit Foil Luxembourg Deal

TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates.

Read more: Toppan to Add FC-BGA Manufacturing Line in January

FREUDENSTADT, GERMANY - Driven by AI server board and high-performance computing momentum, Schmid Group reported preliminary bookings of about 95 million euros for 2025,

Read more: Schmid Reports Solid Order Intake in 2025, Says '26 is 20% Higher

AUSTIN, TX – TechSearch International’s newest Advanced Packaging Update finds that rapid growth in AI servers and data center hardware will push substrate demand beyond available capacity by 2028, forcing manufacturers to expand production within the next three years. The report highlights rising pressure on substrate materials – especially glass fiber used in core constructions – and evaluates potential alternatives as supply tightens.

Read more: TechSearch International Warns of Looming Substrate and Materials Shortages for Advanced Packaging

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