Fab News

TOKYO – Toppan Holdings will build a semiconductor package substrate plant in Singapore, with plans to begin operations at the end of 2026.

Read more: Toppan Plans Singapore Chip Package Substrate Plant

QINGYUAN, CHINA – Chinese PCB fabricator Jinlu Electronics has begun construction on a 2.3 billion yuan ($320 million) expansion project that will add an additional 3 million sq. m. of production capacity for multi-layer rigid boards and high-density interconnect boards.

Read more: Jinlu Electronics Begins $320M Expansion Project

ARLINGTON, VA – JEDEC has published JESD239 Graphics Double Data Rate (GDDR7) SGRAM, which offers double the bandwidth over GDDR6, reaching up to 192 GB/s per device, and is poised to meet the escalating demand for more memory bandwidth in graphics, gaming, compute, networking and AI applications.

Read more: JEDEC Publishes GDDR7 Graphics Memory Standard

PETACH TIKVA, ISRAEL – Eltek saw record full-year revenue of $46.7 million for 2023, representing 18% year-over-year growth.

Read more: Eltek Announces Record Annual Revenue

TAOYUAN, TAIWAN – Chin-Poon Industrial saw full-year revenue of NT$16.7 billion ($530.7 million), a decrease of 4.9% from the previous year.

Read more: Chin-Poon Industrial Reports 4.9% Revenue Decrease

TAOYUAN, TAIWAN – Tripod Technology announced annual revenue of NT$58.9 billion ($1.87 billion), down 11% from 2022.

Read more: Tripod Technology Sees Annual Revenue Drop 11%

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