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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

  • Flex Shock and Vibration

    Flex Shock and Vibration

    PSAs and carefully chosen connectors can reduce the shock of intense conditions.  READ MORE...

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Fab News

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Category: Fab News

MELVILLE, NY – Park Electrochemical Corp. today reported second-quarter sales dropped 24% from last year to $42.5 million.

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BANNOCKBURN, IL – George Milad this week received the IPC Presidents Award, the trade group’s second highest award.

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SAN JOSE, CA – Sanmina-SCI Corp. has received National Aerospace and Defense Contract Accreditation Program (Nadcap) certification for its Hunstville, AL, facility.

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TAIPEI – Unitech Printed Circuit Board has closed on a NT$800 million ($25 million), 58-month loan.

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TAIPEI – Smartphone proliferation is expected to significantly increase rigid-flex PCB demand by the end of the year and into 2011, according to an analyst from the Industrial Economics and Knowledge Center.

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TORONTO -- The Toronto Stock Exchange has given Coretec 120 days to regain compliance with its listing requirements.

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