TAIPEI, TAIWAN – Apple’s iPhone 3GS is forecast to increase sales for flexible PCB (FPCB) suppliers in the US, Japan and Taiwan, reports DigiTimes.
Companies expected to see benefits include: US-based Multi-Fineline Electronix (M-Flex); Japan-based Nippon Mektron and Fujikura; and Taiwan-based Flexium Interconnect and Foxconn Electronics’ FPCB subsidiary.
While a typical smartphone needs 3 to 6 FPCBs, the iPhone 3GS requires more than 10.
Flexium and Foxconn’s subsidiary will supply antenna module and keyboard solutions, according to DigiTimes, while M-Flex, Nippon Mektron and Fujikura will provide FPCBs for the iPhone body.
Flexium expects second-quarter revenue to increase more than 40% on customer demand for smartphone-related products, says DigiTimes.
Nippon and Fujikura ranked second and eleventh, respectively, on Dr. Hayo Nakahara’s 2007 NTI 100 list, while M-Flex ranked twenty-sixth.
BOTTEGONE, ITALY – The weak global economy has claimed another victim. Isola Group announced it will close MAS Italia, its laminate manufacturing operation located here.
Shareholders have authorized liquidation, beginning the legal process to settle with creditors.
Isola will relocate production to its Isola GmbH operation in Duren, Germany. A limited number of MAS Italia customer service, accounting and sales staff will be retained.
In a release, Isola Group CEO Ray Sharpe said it was no longer viable for the company to operate two large laminate production facilities in Europe. “Current market demand can be more adequately met by one facility operating in Germany, the largest laminate market in Europe.”
CHICAGO – Electronic Interconnect Technology Inc. (EIC) named NOAH Industries Inc. as its representative in Florida, West Virginia, Maryland and Virginia. EIC manufactures PCBs, from single-sided to multilayer from prototype through production, for design engineers and contract assemblers. NOAH provides numerous services, including design, project management, custom fiber optics, PCB layout and packaging.
HONG KONG – Dow Epoxy, a business unit of The Dow Chemical Company, will increase prices for its epoxy resins in Asia Pacific.
Effective July 1, the firm will increase the prices for its liquid, liquid blend, solid, solid solution, brominated epoxy resin and epoxy novolac resin products by $100/MT.
The increase will be implemented immediately as contracts allow.
ANAHEIM, CA – John Papagni has joined the DDi management team as the director of ATE and burn-in board technology. Papagni has over 30 years of experience in providing design and manufacturing support for semiconductor testing, with a focus on probe cards, THB/HAST boards, ATE/DUT boards and burn-in boards.
