Xpeedic's RF Electronic Design Automation Solution includes XDS, Xpeedic’s RF system-level design and simulation platform, IRIS, its on-chip passive modeling and simulation tool, and iModeler, a passive model generation tool.

The latest release of ExpressPCB Plus layout software, version 3.2.0, brings improved performance and flexibility for designers.

Siemens' incorporation of the Supplyframe Design-to-Source Intelligence platform with the Xpedition software for electronic systems design facilitates supply chain resilience by providing real-time visibility into global component availability, demand, cost, compliance and associated parametric data at the point of design.

Stackpole’s RNCL thin film high power anti-surge chip resistors provide high power ratings per chip size with resistance values down to 50mΩ.