Inducted May 2020

Manlio B. Melillo, Ph.D. ((August 28, 1927 - April 9, 2007) and Daniel P. Vlachos (1937-2007) invented the first high-speed electrolytic copper plating bath. They determined the proper composition of a bath with throwing power high enough to deposit copper substantially evenly between a flat surface and the apertures (through-holes), and in such a way to ensure a ductile, smooth and uniformly distributed copper deposit. Their patent paved the way to produce printed circuit boards in high volumes.

Melillo (pictured below) received a Ph.D with honors in chemistry from the University of Naples, Italy. Worked for 24 years as chief scientist on defense systems for firms such as Bunker-Ramo, Lockheed, General Dynamics, and as president of Datakote. He was awarded six US patents in thin-film coatings.

Inducted 2018

Natsuo Sawa and Masahiro Hoda coinvented and patented a "method of rust preventing for copper and copper alloy." The scientists proposed surface-treating copper with a 2-alkylimidazole or an acid addition salt. Their invention, known today as OSP, or organic solderability protectant, is used on more than 60% of printed circuit boards worldwide.

Inducted May 2013

Charles Ducas was an American inventor and the first to describe etching and plated up conductors, as well as the precursors to multilayer circuit boards. In 1925, Ducas submitted a patent application for a method of creating an electrical path directly on an insulated surface by printing through a stencil with electrically conductive inks. This method is credited as the source of the term "printed wiring" or "printed circuit." In the patent, Ducas conceived forming grooves in a dielectric and filling them with conductive paste, then electroplating the paste. Conductive paste could also be printed, or stenciled onto dielectric and then electroplated. Both sides of the dielectric layer could be used for circuitry. Ducus made mention of the future of multilayer boards, stating: “Two or more panels may be positioned adjacent to each other... .” In another application, Ducas described electroplating a copper, silver or gold pattern onto a low temperature metal alloy through a contact mask, with heating applied to separate the conductor from the fusible bus plate and mask.

Inducted May 2013

Victor Dahlgren was among the first to fully describe and develop processes for printing and etching flat conductors on flexible base materials. It was a significant development because it allowed manufacturers to migrate from the more labor-intensive (and more expensive) wire harness. Indeed, Dahlgren was the originator of printed etched flexible cable used extensively in the NASA Apollo Space Program. Dahlgren (1923-2002), a mechanical engineer, joined Sanders Associates in 1952, during which time he received 18 patents. In 1963 he co-founded Electro Mechanisms (later Teledyne Electro Mechanisms), and in 1970 he cofounded TME Corp. (later Chomerics). He retired in 1988 from Lockheed Sanders after 20 years of service.