20 January 2020 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, will feature its brand new and enhanced set of high-performance, high-reliability high-speed / low-loss / high-frequency materials at the upcoming DesignCon and IPC APEX Expos. The Ventec technology team will be in Santa Clara (CA) at DesignCon on Booth #205 and key company executives will be joined by the US-team at IPC APEX in San Diego (CA) on booth #4434.

Read more: Ventec’s High-Speed/Low-Loss/High-Frequency Material Technology Takes Center Stage at US-Expos

Printed circuit boards (PCBs) plays an important role in our day to day life.

Read more: CML manufactures Insulated Metal Substrate (IMS) solutions

Santa Clara, CA January 9th, 2020 – Averatek Incorporated has announced their participation in this year’s IPC APEX EXPO Conference and Exposition being held February 4th thru February 6th, at the San Diego Convention Center. Averatek will be presenting advanced PCB manufacturing technology as well as sharing expertise and experience in its deployment.

Read more: Averatek Releases New High-Density Process Details at IPC APEX EXPO 2020

Here come previously impossible devices and structures. The new IDTechEx report, “Smart Material Opportunities in Structural Electronics 2020-2030” analyses and forecasts a remarkable $200 billion materials opportunity by making dumb structures smart.

Read more: Smart Materials Replace Components: A New $200 Billion Business Forecasts IDTechEx