January 15 - 17 2020

Irvine California, USA – TopLine will exhibit its innovative CCGA technology and Daisy Chain component solutions at INTERNEPCON JAPAN from 15 - 17 January 2020 at the Tokyo Big Sight venue. INTERNEPCON JAPAN is one of seven (7) shows comprising NEPCON JAPAN 2020,  the 34th Electronics R&D, Manufacturing and Packaging Technology Expo. TopLine will exhibit in Booth S4 – 17.

Read more: TopLine Exhibiting CCGA, Daisy Chain Solutions at INTERNEPCON, Tokyo

Ventec International Group Co., Ltd. (6672 TT) has significantly increased its PTFE laminate manufacturing capabilities following a strategic investment in a new state-of-the-art high-temperature press and lay-up/break-down line at its Suzhou (China) manufacturing plant.

Read more: Ventec invests in key equipment to support expansion of PTFE laminates manufacturing capabilities

(BOSTON, Mass.) — NEWS: Carpe Diem Technologies, Inc. (Carpe Diem) has signed an exclusive license agreement with the University of Minnesota for the commercialization of breakthrough printed electronics technology. The technology is called SCALE (Self-aligned Capillarity-Assisted Lithography for Electronics), and is particularly suitable for printing on flexible substrates, such as paper and plastic.

Read more: Carpe Diem Technologies Receives Exclusive License for Nano Imprint Aligned Printed Electronics

PROSPECT, CT— (December 11, 2019)—Design-2-Part (D2P) Shows, a series of design and contract manufacturing trade shows, has established a new annual attendance record. The eleven 2019 shows combined to deliver 16,894 engineers and buyers, the highest number in the 45-year history of D2P. The new mark shattered the previous high of 14,935 set in 2018 and represented a 13.1% increase.

Read more: Design-2-Part Shows Draws Record Attendance in 2019