Press Releases

5G Technology, Market and Forecasts 2020-2030

Dr Luyun Jiang, Technology Analyst at IDTechEx, has recently published the below article exploring the 5G market. This article follows the release of the IDTechEx report, "5G Technology, Market and Forecasts 2020-2030".

Read more: The Market for 5G Will Reach About $720 Billion by 2030

Streamlining Bills of Materials (BOM) with End-of-Life Alerts, Product Change Notifications and Obsolescence Management

Read more: Altium and IHS Markit Partner to Solve Component End-of-Life Issues for PCB Design

Picture a flexible circuit board (FPCB) and you will almost inevitably visualise a sheet of orange/brown plastic, probably with a few copper traces and maybe some soldered components on it. This plastic is PI (polyimide/Kapton), and its ubiquity is primarily due to its temperature resistance and general durability. Indeed, it is so durable and insensitive to temperature that PI is routinely used in laboratory ovens, cryostats, and (when laminated with aluminium) wrapped around satellites.

Read more: Flexible Hybrid Electronics: Strategies to Enable Cheaper Substrates

“The goal of the IPC 2-12c Cybersecurity Protection Standard Task Group is to develop a new industry standard to provide a system to reduce the manufacturing supply-chain cybersecurity risks. We are pleased to have Didrik Bech and his experience within cybersecurity onboard as Vice Chair,” says Chris Jorgensen, Director Technology Transfer at IPC.

Read more: Elmatica CEO to Serve as Vice Chair for New IPC Cyber Security Task Group

Mr. Anaya Vardya, president and CEO of American Standard Circuits, announced that his company has acquired a new 8 camera post etch punch from C.A. Picard. The new VIP-25 is the final piece in a plan to establish the highest front-end registration capabilities possible.

Read more: American Standard Circuits Installs New Post Etch Punch System

Atlanta, GA – ECIA’s Global Industry Practices Committee (GIPC) issued a document to provide areas for consideration and best practices for how manufacturers, distributors and manufacturer’s representatives in the electronic component industry can safely and effectively adapt their selling organizations in response to the Covid-19 pandemic. The content in this document is derived from a combination of remote customer engagement policies and strategies along with guidance regarding face to face selling activities and other external stakeholder meetings.

Read more: ECIA Issues Guidelines for Safely Interacting with Customers and Business Partners Post Covid-19

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