In-Mold Electronics (IME) will one day become a well-established process with a well-developed ecosystem and a mature, easy-to-use design-to-product workflow. This process will become the basis of many novel structural electronic designs and products. This art-to-production platform transformation will take further time. It is often asked when and how this will happen. In this article, Dr Khasha Ghaffarzadeh, Research Director at IDTechEx, will share some insights and analysis. This analysis is drawn from the IDTechEx report, In-Mold Electronics 2019-2029: Technology, Market Forecasts, Players, which is the result of years research into IME or associated technologies such as inks, pick-and-place, printing, and so on.

Read more: In-Mold Electronics: Starting Simple to Reach One Billion Dollars

(Waterbury, CT USA) - February 17, 2020 – MacDermid Alpha Electronics Solutions, a global leader in high performance semiconductor chemistries and assembly materials, will exhibit total process solutions for emerging packaging at the IMAPS Conference, Fountain Hills, AZ, March 3-5, 2020.

Read more: MacDermid Alpha to Exhibit and Present at the Upcoming IMAPS Device Packaging Conference