Leoben, 25 April 2017 – Fraunhofer IAF has developed a fully integrated monolithic multilevel converter in high-volt AlGaN/GaN-on-Si technology. The integrated inverter circuit is designed for maximum voltages of +/- 400 V and currents of 5 A.
Insulectro, the largest distributor of materials for use in printed circuit boards and printed electronics, has just added popular constructions of DuPont’s flexible laminates to its PumaFast stocking inventories.
April 24, 2017 – Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs is pleased to announce the appointment of Kyle Pattie as Account Manager for the US Eastern region, selling and supporting all product lines to help the company further develop its presence in the region.
[April 25, 2017: New Bedford, MA] With the latest enhancement in SMART Human-Machine Interface (HMI) technologies and to better assist customers’ needs, Epec recently announced the hiring of Steve Goodman, the new User Interface Product Manager.
SAE Circuits Express has installed a new NTO 2424-LF lead-free hot air solder leveling machine. This machine is recipe driven and will provide industry-leading coating consistency and surface finish. This equipment has undergone final process validation and is fully operational and released into production. The NTO machine will give SAE Circuits Express the in-house capability for lead free HASL coating and gives us the ability to meet our customer's demand for lead free HASL PCBs in as little as 48 hrs.
New SAP Distributed Manufacturing application enables additive manufacturing “just in time”
Heraeus was selected for the collaboration as a materials expert for special metals