Press Releases

NESS ZIONA, ISRAEL -- Nano Dimension Ltd., a leader in the field of 3D printed electronics (NASDAQ, TASE: NNDM), announced today that its wholly owned subsidiary, Nano Dimension Technologies Ltd., has supplied its flagship DragonFly 2020 3D Printer to a PCB design bureau, located in Israel.  This design bureau helps a broad range of companies design and manufacture PCBs, and will examine Nano Dimension's cutting-edge technology.  This customer joins the growing ranks of Nano Dimension’s beta customers.

Read more: Nano Dimension Supplies 3D Printer to a PCB Design Bureau

BANNOCKBURN, IL – Executives and staff at an IPC-member facility held a town hall discussion with Congresswoman Zoe Lofgren (D-CA-19) on the federal policy issues facing the advanced manufacturing industry. Rep. Lofgren took a tour of TTM Technologies, Inc. ("TTM") in San Jose, getting a first-hand look at the high-tech work being done in TTM’s facility.

Read more: Congresswoman Discusses U.S. Policy Priorities with IPC Member-company, TTM Technologies

To demonstrate their continued commitment to quality, Electrotek Corporation announces that they have been successful in achieving Nadcap accreditation for
Electronics, Printed Circuit Boards.

Read more: Electrotek Receives Nadcap Accreditation for Electronics, Printed Boards

atg Luther & Maelzer GmbH confirms the order for high-speed bare board testing technology.

Read more: Colonial Circuits Adds Second atg Flying Probe Test System

Brett McCoy, COO for Eagle Electronics of Schaumburg, Illinois announced that his company has recently placed a purchase order for two LENZ DLG 615-2 Y765 drills.

Read more: Eagle Electronics Accelerates Production with Two LENZ Drilling Machines

NORWOOD, MA -- Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond Copper (DBC) substrates. Now circuit designers are able to interconnect both sides of DBC substrates with either PTV® copper plugged vias or copper coated through-holes.

Read more: Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates

Page 286 of 303

Subcategories