Gent, Belgium – June 7th, 2017 – Stella Corporation a leading Japanese PCB software company, announces the completion of its support for Gerber X2 in Stella Vision.
NESS ZIONA, Israel- June 6, 2017 - Nano Dimension Ltd., a leader in the field of 3D printed electronics (NASDAQ, TASE: NNDM), announced today that its wholly owned subsidiary, Nano Dimension Technologies Ltd., has developed novel copper nanoparticles that are resistant to oxidation and fuse into a conductive line after sintering process at temperatures lower than 160C.
Norwood, MA. June 2, 2017. Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has added gold tin plated Ceramic Combo Lids to its line of ceramic SMT packages.
Matrix is pleased to announce the appointment of Mr. Robert Berg as Vice President of Sales and Business Development.
YAVNE, Israel, May 30, 2017 /PRNewswire/ -- Orbotech Ltd., a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products, today announced a $24 million order with Xianyang CaiHong Optoelectronics Technology Co. Ltd., ("CHOT"), a Chinese flat panel display manufacturer and part of the China Electronics Corporation (CEC).
Anaheim, CA – May 26, 2017 – Summit Interconnect, Inc. announces the addition of Doug A. Scrimes as the Vice President and General Manager of the Anaheim division. Mr. Scrimes has held a number of senior leadership positions in his 35 year career in the printed circuit board industry.