Press Releases

30th October 2017 – Ventec International Group, a world leader in the production of insulated metal substrates, thermally conductive polyimide & high reliability laminates and prepregs, will showcase its comprehensive range of laminate materials at this year’s Productronica.

Read more: Ventec to Showcase Thermal Management Solutions and latest Laminate Technology at Productronica

C.N. Chen, president of Taiwan Union Technology Corporation (TUC), is pleased to announce the appointment of John Strubbe as Vice President – Technology.

Read more: TUC Appoints John Strubbe Vice President – Technology

Increase in business and focus on compliance leads to adjustments in the Customer Service department, for Printed Circuit Broker Elmatica.

Read more: Elmatica appoints new Customer Service Manager

October, 2017 – Seica Inc. is pleased to announce the relocation of its North American headquarters from Salem, New Hampshire to Ward Hill Business Park East, 110 Avco Road, Haverhill, Massachusetts 01835.

Read more: Relocation of Seica Headquarter USA

Visit SCHMID at the productronica in Munich from Nov. 14 to Nov. 17, 2017 and get to know our product and technology innovations. You will find us at booth 205 in hall B3.

Read more: SCHMID will present its innovation InfinityLine V+ at productronica 2017

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.

Read more: ESA Approval for Ventec Material in Amphenol Invotec Rigid & Flex-Rigid Production

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