Chandler, AZ - Rogers Corporation’s (NYSE:ROG) Advanced Connectivity Solutions team will be presenting the latest developments in printed-circuit-board (PCB) materials for emerging high-frequency applications at the upcoming IPC APEX EXPO 2018 (http://www.ipcapexexpo.org), Feb. 27 – March 1, 2018 at the San Diego Convention Center.
As part of the technical program, Rogers’ Technical Marketing Manager, John Coonrod, is scheduled to present “Practical Considerations for PCB Impedance Measurements” on Wednesday, February 28th, from 1:30 PM to 3:00 PM as part of the technical conference session - S16: PCB Signal Integrity/High Speed/ High Frequency.
Rogers at Booth 500
On the exhibition floor, Rogers’ technical team will be at booth 500 with examples of their diverse circuit materials as well as guidance and advice on achieving optimum performance with materials such as RO4460G2™ bondply and RO4730G30™ laminates.
Rogers Corporation recently introduced RO4460G2 low loss bondply with a 6.15 dielectric constant (Dk). RO4000® thermoset high performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers’ high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. The introduction of RO4460G2 bondply now provides designers a 0.004” (0.101 mm) bonding layer that complements the RO4360G2™ low loss, glass-reinforced 6.15 Dk copper clad thermoset laminates.
RO4460G2 bondply exhibits excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability, and thermoset bond temperatures compatible with standard epoxy/glass (FR-4) processes. RO4460G2 bondply is an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4400™ bondplies are capable of withstanding multiple lamination cycles. Each of the RO4400 bondplies have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.
Thinner core options are available for RO4730G3 laminates. In 2016 Rogers launched RO4730G3 UL 94 V-0 antenna grade laminates, which combines a flame retardant, low loss thermoset dielectric with patented LoPro® copper foil, and incorporates a proprietary filler system that brings to market a material solution that addresses many of today’s challenges. As we’ve witnessed antennas developed for 4G (LTE-Advanced) and beyond (5G) becoming more complex, there has been further desire by antenna designers for thinner core constructions, and in 2017 Rogers qualified additional 5 mil and 10 mil thickness options. RO4730G3 laminates bring to market a flame retardant material that has a Dk match to 3.0, Df of 0.0023 (2.5 GHz), low z-axis CTE for plated through hole reliability, low density microspheres yielding a laminate 30% lighter than PTFE products, and compatibility with conventional epoxy and high temperature lead-free solder processing. With the right combination of materials, RO4730G3 laminates provide an optimum blend of price, performance, and durability.
These are just a couple of examples of Rogers’ circuit materials lineup, with more on display at Rogers’ booth 500 at the upcoming IPC APEX EXPO 2018. Visitors can learn more about the benefits of each material along with application assistance at the Rogers’ booth.
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com.
