Printed Circuit Design & Fab Online Magazine - Current

Press Releases

Ventec International Group Co., Ltd. (6672 TT) has significantly increased its PTFE laminate manufacturing capabilities following a strategic investment in a new state-of-the-art high-temperature press and lay-up/break-down line at its Suzhou (China) manufacturing plant.

Read more: Ventec invests in key equipment to support expansion of PTFE laminates manufacturing capabilities

(BOSTON, Mass.) — NEWS: Carpe Diem Technologies, Inc. (Carpe Diem) has signed an exclusive license agreement with the University of Minnesota for the commercialization of breakthrough printed electronics technology. The technology is called SCALE (Self-aligned Capillarity-Assisted Lithography for Electronics), and is particularly suitable for printing on flexible substrates, such as paper and plastic.

Read more: Carpe Diem Technologies Receives Exclusive License for Nano Imprint Aligned Printed Electronics

PROSPECT, CT— (December 11, 2019)—Design-2-Part (D2P) Shows, a series of design and contract manufacturing trade shows, has established a new annual attendance record. The eleven 2019 shows combined to deliver 16,894 engineers and buyers, the highest number in the 45-year history of D2P. The new mark shattered the previous high of 14,935 set in 2018 and represented a 13.1% increase.

Read more: Design-2-Part Shows Draws Record Attendance in 2019

WASHINGTON, D.C. — Thomas J. Donohue, CEO, U.S. Chamber of Commerce issued the following statement in response to news that the administration and House Democrats have reached a handshake deal on the United States-Mexico-Canada Agreement (USMCA):

Read more: U.S. Chamber Statement on USMCA Handshake Deal

LYON, France - December 9, 2019 | “Our world is going digital. And this revolution will clearly impacts the printing technologies” says Gaël Giusti, PhD. Technology & Market Analyst, Semiconductor Manufacturing at Yole Développement (Yole), “Emerging printing technologies are benefiting most from this move. They are now on the verge of replacing some conventional manufacturing techniques in the electronics, microelectronics and display industries”.

Read more: Emerging printing fills the gap for rising electronics applications

SANTA ANA, Calif., Dec. 02, 2019 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (TTMI), a leading global printed circuit board (“PCB”) products, radio frequency (“RF”) components and engineered solutions manufacturer, announced today that it will participate in the International Electronics Circuit Exhibition (Shenzhen) 2019, held from December 4 to 6 at the Shenzhen Convention and Exhibition Center in Shenzhen, China. Building upon the theme of “Inspiring Innovation”, TTM Technologies’ (TTM) technical experts will conduct a series of sessions to share views on important industry trends and the company’s latest innovative technologies to help customers successfully address these trends. The sessions will cover a range of important topics for the markets TTM serves, including – “mSAP Technology-Enabled Substrate-Like-PCB (SLP) Application,” “PCB Design Trend and Challenge for Telecom and Networking”, “Technologies for mmWave Application – the Values TTM brings to the Development of Radar PCBs”. TTM’s booth number for the event is 1L01.

Read more: TTM Technologies, Inc. to exhibit at the International Electronics Circuit Exhibition (Shenzhen)...