“The Swedish Security and Defense Industry Association are pleased to welcome Elmatica as a new member,” Secretary-General, Robert Limmergård stated.
Chandler, AZ - Rogers Corporation (NYSE:ROG) is exhibiting at the upcoming PCB West show. The PCB West exhibition will be held on September 10th, 2019 at the Santa Clara Convention Center (Santa Clara, CA). Visitors will find plenty of the latest high-performance circuit materials from Rogers Corp. at booth 201.
BANNOCKBURN, Ill., USA, September 3, 2019 — IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.
3 September 2019 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, will be showcasing its latest high reliability PCB materials at two key industry trade shows in the US this month.
August 30, 2019 | Miva Technologies
Chris Hrusovsky, MivaTek global vice president of business development, is excited to announce the company installed its first reel-to-reel, flexible circuit capable, 10-micron direct imaging system. The system was designed based on their patented quad-wave DLP direct write technology at a high-volume manufacturer of precision technologies in the Central USA.
Help bring together technology and product development best practices by presenting your thought leadership at the 2020 MD&M West Conference , being held on February 11-13, 2020 at the Anaheim Convention Center. Abstract submissions are now being accepted for topics in 4 areas: