Printed Circuit Design & Fab Online Magazine - Current

Press Releases

Chamber’s Donohue: ‘One step closer to realizing the substantive benefits of USMCA’

Read more: U.S. Chamber Statement on House Passage of USMCA

In November, Ucamco was present at a very interesting and successful edition of Productronica, the world’s leading trade fair for electronics development and production.

Read more: Long-standing partnership Eurocircuits + Ucamco

Printed Circuit Broker Elmatica announces a further expansion of their Technology Department with the hiring of Joseph Milsom in the position of IT Developer. Elmatica has a dedicated focus on developing the best IT solutions for securing their customers articles and data.

Read more: Elmatica further expands their Technology Department

AUSTIN, Texas, Dec. 17, 2019 /PRNewswire/ -- Octavo systems, the leader in System-in-Package (SiP) technology, announced today a Hardware Design Review Consulting Service for customers leveraging their SiP technology in their Design.

Read more: Octavo Systems to Offer Hardware Design Review Service

January 15 - 17 2020

Irvine California, USA – TopLine will exhibit its innovative CCGA technology and Daisy Chain component solutions at INTERNEPCON JAPAN from 15 - 17 January 2020 at the Tokyo Big Sight venue. INTERNEPCON JAPAN is one of seven (7) shows comprising NEPCON JAPAN 2020, the 34th Electronics R&D, Manufacturing and Packaging Technology Expo. TopLine will exhibit in Booth S4 – 17.

Read more: TopLine Exhibiting CCGA, Daisy Chain Solutions at INTERNEPCON, Tokyo

Ventec International Group Co., Ltd. (6672 TT) has significantly increased its PTFE laminate manufacturing capabilities following a strategic investment in a new state-of-the-art high-temperature press and lay-up/break-down line at its Suzhou (China) manufacturing plant.

Read more: Ventec invests in key equipment to support expansion of PTFE laminates manufacturing capabilities