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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

  • Flex Shock and Vibration

    Flex Shock and Vibration

    PSAs and carefully chosen connectors can reduce the shock of intense conditions.  READ MORE...

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Press Releases

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Category: Press Releases

ZHKRPCB LTD has released PCB Instant Quote online. Customers can now order various PCB components online based on their specifications and needs.Electronics Industries looking for PCB components can now visit ZHKRPCB...

Read more: ZHKRPCB LTD Launches New Form of Buying Printed Circuit Board Devices Online

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Chandler, Arizona – Rogers Corporation (NYSE:ROG) will exhibit at DesignCon in Santa Clara, CA (at booth #421) highlighting some of its high performance circuit materials used in multilayer structures which include a family of thin laminates, bonding materials, and sheeted copper foil options.

Read more: Rogers Corporation to Highlight High Speed Digital Laminates & Next Generation Thin Materials for...

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Haverhill, MA January, 2020. Standard One of a Kind: innovation is truly standard for Seica Inc., and the resulting unique and unusual solutions will be on full display at Apex 2020.

Read more: Press preview for Seica Inc. participation at Apex, San Diego, CA, February 4-6 2020, Booth 1922...

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Category: Press Releases

Schweizer Electronic AG and Nagase & Co., Ltd. have entered into a sales distribution agreement for Japan.

Read more: Schweizer signs distribution agreement with Nagase

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Category: Press Releases

LAS VEGAS--(BUSINESS WIRE)--A number of electronics industry leaders have received formal recognition from the U.S. Environmental Protection Agency (EPA) as part of the EPA’s 2020 Sustainable Materials Management Electronics Challenge Awards. The awards were announced and presented at yesterday’s Consumer Electronics Show (CES) in Las Vegas.

Read more: ERI Applauds its Electronics Industry Partners for Achieving EPA Recognition and Awards

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LYON, France - January 9, 2020 | “The EV/HEV race has begun, affirms Milan Rosina, PhD Principal Analyst, Power & Wireless and Batteries at Yole Développement (Yole) the Transition period towards full vehicle electrification is entering into its next phase, with important vehicle electrification strategic plans announced by conventional automotive players and focus on stronger vehicle electrification”.

Read more: EV/HEV is driving power electronics innovations

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