Schaumburg, IL.  October 1, 2019.  Bowman, the premier manufacturer of world class, American-Made XRF plating measurement instruments, has expanded its global partnership network with strategic appointments in 3 key regions.

Read more: Bowman Expands Global Network with Strategic Appointments in 3 Regions

Experts discussed innovative solutions for continued miniaturization, higher power densities, high-speed communication (5G) and electromobility

Read more: AT&S presented advanced PCB and packaging technology at 15th Technology Forum

Berlin, September 26, 2019: Atotech, a world-wide leader in the field of chemicals and equipment for printed circuit board and package substrate manufacturing, will present at the 52nd International Symposium on Microelectronics, held at the Hynes Convention Center in Boston, Massachusetts, from September 30 through October 3, 2019.

Read more: Atotech to participate in the 52nd International Symposium on Microelectronics in Boston,...

Istituto Italiano di Technologia plans to use the packaging for rapid device and microsystem prototyping of micro-electro-mechanical systems and wearable transducers

Read more: IIT Prints 3D Embedded Sensors in Electrical Packaging for Next Generation MEMS Devices Using Nano...