Chandler, AZ - Rogers Corporation (NYSE:ROG) is exhibiting at the upcoming PCB West show. The PCB West exhibition will be held on September 10th, 2019 at the Santa Clara Convention Center (Santa Clara, CA). Visitors will find plenty of the latest high-performance circuit materials from Rogers Corp. at booth 201.
Read more: Rogers Corporation to Offer Material Solutions at PCB West 2019 Exhibition
BANNOCKBURN, Ill., USA, September 3, 2019 — IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.
Read more: IPC E-Textiles Europe 2019 to Bring Technical Education to European E-textiles Community
3 September 2019 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, will be showcasing its latest high reliability PCB materials at two key industry trade shows in the US this month.
Read more: Ventec to Showcase High-Speed/High-Frequency & Advanced IMS Material Technology at key US-Expos
Chris Hrusovsky, MivaTek global vice president of business development, is excited to announce the company installed its first reel-to-reel, flexible circuit capable, 10-micron direct imaging system. The system was designed based on their patented quad-wave DLP direct write technology at a high-volume manufacturer of precision technologies in the Central USA.
Read more: Miva Technologies Releases 2000RR: 10-micron Capable Reel-to-Reel Direct Imaging System
Help bring together technology and product development best practices by presenting your thought leadership at the 2020 MD&M West Conference , being held on February 11-13, 2020 at the Anaheim Convention Center. Abstract submissions are now being accepted for topics in 4 areas:
Read more: 2020 MD&M West Call for Speakers – Closes Tomorrow!
29 August 2019 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, is pleased to announce the addition of two new thermally conductive thin isolation foil materials to its range of Thermal Interface Materials (TIM) under its distribution agreement with EMI Thermal.
Read more: Ventec Expands Thermal Interface Materials Range
