EcoSonic ESD Paper is a static-dissipative, corrosion-inhibiting packaging paper for electrical and electronic items. Protects sensitive electronic metal items from static electricity buildup and corrosion. Eliminates static electricity buildup through use of an environmentally friendly coating made from soybean oil and coated on the surface of the paper. Is said to perform better on static half-life test (a test with an environment consisting of little or no humidity) than papers with conventional anti-stat coatings consisting of alkyl ammonium chlorides, typical ethoxylated amines, typical imidazolines, phosphated esters, and nonionic based antistat coatings. Is thermally stable at temperatures in excess of 392°F (200°C) and pH stable between 2 and 11 at temperatures in excess of 100°F (38°C) for several days. Conforms to MIL-PRF-81705D (Static Decay Rate and Surface Resistivity). Provides contact, vapor, and barrier phase corrosion inhibition for ferrous and non-ferrous metals. Conforms to MIL-PRF-3420H (vapor inhibiting ability) and is said to be effective against aggressive environments including humidity, SO2, H2S, and galvanic corrosion from dissimilar metals. Is free of nitrites, phosphates, silicates, and other hazardous compounds and is nontoxic, biodegradable, and fully recyclable/repulpable. Made from neutral natural kraft paper without using chlorine or other bleaching. Can be used to protect any material capable of being damaged by electrostatic discharge including printed circuit boards (PCBs), components and integrated circuits.
Cortec, www.cortecvci.com/Publications/PDS/EcoSonic_ESD_Paper_Powered_by_NANO-VpCI.pdf
IsoPro 4.0 software edits and converts Gerber, Excellon Drill, and DXF files for use by the Quick Circuit prototyping system.
Mezza-pede SMT connectors now include a lower profile DHAL header that reportedly reduces board stack height by 15%. Features 0.025" insulator. When paired with mating socket model DHS, a z-axis stack height of 0.132" is achievable. Facilitates a reduction in package height and a shorter signal path in applications ranging from tunable laser power connectors in optical transceivers to handheld medical electronics. For use in 1mm pitch board-to-board and cable-to-board interconnections in high-density electronic designs. DHAL is available with 14 positions and features SMT lead frame and pin design that combines high-reliability screw-machined terminals with over-molded lead frame in a precision-molded LCP insulator. Is RoHS compliant, usable at operating temperatures from -55° to +125°C; can handle up to 1.1A current at 80°C.
Advanced Interconnections Corp., www.advanced.com
RO4830 high-frequency laminates are processed by standard epoxy/glass (FR-4) circuit fabrication methods.
ST-Line solder mask and dry-film pretreatment process equipment is fully compatible with CupraEtch pretreatment chemistry and reportedly boosts yields to control production costs.
S100 table top depaneling saw for singulating printed circuit board panels is up to 12" long.