127-31 one-component (100% solids) thermally conductive epoxy adhesive, encapsulant and potting compound is electrically insulating, with a thermal conductivity of 3.0 W/mK.
CR-8000 2017 CAD software enhances electrical and electronic co-design at the architectural design phase.
Avia LX 355-20 is a q-switched, diode-pumped solid-state (DPSS) laser.
6810 Series FPC and FFC connectors feature one-touch locking. Provide automatic locking upon full insertion. Heat resistant up to 125C (257F) for automotive, industrial and consumer electronics applications. Proprietary structure enables quick, stable connections in a single insertion, for fully automated assembly. Designed to support AOI for high-speed quality assurance. Come in two configurations: a straight type that mounts perpendicular to the circuit board for vertical insertion, and a right-angle type mounting parallel to board for horizontal insertion.
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BondFilm LDD MSAP low-temperature pretreatment process prepares circuit board surfaces for laser direct drilling at a etch depth of 0.5µm.
CircuitShield anti-corrosion and waterproofing coating contains a novel chemical plasma coating that replaces traditional encapsulants and coatings.