MacuSpec AVF 700 electrolytic copper metallization process is for filling microvias in printed circuit boards.

Sherlock automated design analysis software v. 5.3 now features thermal-mechanical analysis, which provides the ability to capture system-level effects on solder joint reliability during temperature cycling.

Cadence Allegro DesignTrueDFM technology performs real-time, in-design design-for-manufacturing (DfM) checks integrated with electrical, physical and spacing design rule checks (DRCs).

EMA Constraint Manager for OrCAD is said to ensure design intent is communicated and adhered to during PCB implementation.