Products

BLM18SP_SH1 chip ferrite beads for noise suppression are for use in automotive power supply applications.

Read more: Murata Introduces BLM18SP_SH1 Ferrite Chip Beads

Systek SAP buildup processes for IC substrate RDL have a four-step desmear process that can be calibrated to prepare multiple substrate materials, imparting minimal roughness while ensuring clean via side walls and copper target pads.

Read more: MacDermid Alpha Releases Systek SAP Buildup Process

GRM011R60J104M multilayer ceramic capacitor features max. capacitance of 0.1µF in 008004".

Read more: Murata Rolls Out GRM011R60J104M Multilayer Ceramic Capacitor

SMT PCB connectors transmit signals or power across PCBs.

Read more: Keystone Develops SMT PCB Connectors

The 0.5mm-pitch FH67 series FPC connector with single-action lock satisfies automotive requirements and is commonly used in consumer, gaming, industrial, medical and robotics applications.

Read more: Hirose Introduces FH67 Series FPC Connector

inspectAR 2.0 has an upgraded algorithm used to track AR overlays onto PCBs.

Read more: inspectAR Releases inspectAR 2.0 AR PCB Debugging Tool

Page 82 of 403