BLM18SP_SH1 chip ferrite beads for noise suppression are for use in automotive power supply applications.
Systek SAP buildup processes for IC substrate RDL have a four-step desmear process that can be calibrated to prepare multiple substrate materials, imparting minimal roughness while ensuring clean via side walls and copper target pads.
GRM011R60J104M multilayer ceramic capacitor features max. capacitance of 0.1µF in 008004".
SMT PCB connectors transmit signals or power across PCBs.
The 0.5mm-pitch FH67 series FPC connector with single-action lock satisfies automotive requirements and is commonly used in consumer, gaming, industrial, medical and robotics applications.
inspectAR 2.0 has an upgraded algorithm used to track AR overlays onto PCBs.