SpeedWave 300P ultra-low loss prepreg can be used to bond XtremeSpeed RO1200, CLTE-MW, and RO4000 series laminates.

Offers dielectric constant of 3 to 3.3 and a dissipation factor of 0.0019 to 0.0022 at 10GHz with stable performance over broad frequency range. Is offered in multiple spread and open weave glass styles and resin content combinations. Reportedly provides excellent thermal reliability for high layer count designs requiring multiple sequential laminations. Delivers superior fill and flow capability around heavy copper features, a low z-axis expansion for plated through-hole reliability and is CAF-resistant. UL 94 V-0 rated material is compatible with modified FR-4 fabrication processes and Pb-free PCB assembly processing.

Rogers Corp.
rogerscorp.com

PCB West Virtual 2020 has more than 125 hours’ worth of technical sessions on printed circuit design and manufacturing available through Oct. 12.  pcbwest.com 

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