Blackhole LE and Eclipse LE modified semi-additive processing (mSAP) for direct metallization enable direct copper electroplating to laminate walls and copper target pads of microvia structures without need for intermediary copper layers from electroless or electrolytic flash plating.

Can be used to create high circuit density with high manufacturing quality and process yields. Existing Blackhole or Eclipse lines can be upgraded to the LE variation with equipment modifications and chemical replacement. Use with MacuSpec VF-TH 300 via filling technology to create reliable mSAP layers with shorter or no post bake while still resistant to V-pitting defects during layer final etch.

MacDermid Alpha Electronics Solutions

microviareliability.com

PCB West Virtual 2020 has more than 125 hours’ worth of technical sessions on printed circuit design and manufacturing available through Oct. 12. pcbwest.com

• Prev
• Next