TIVP Series (IsoVu Gen 2) extends applications for isolated probe technology to all of power system design with a smaller size, improved ease of use, and enhanced electrical performance.

Modified-PI FPC combines MPI and low dielectric adhesives to achieve higher resistance to bending and heat and similar transmission properties to liquid crystal polymer FPC.

Card edge power connectors now include single-beam, HD-heightened, HD-plus 5- and 8-beam connectors.

X3000 LDI system reportedly can handle the largest panels for dry-film patterning and solder mask imaging in PCB production.