Printed Circuit Design & Fab Online Magazine - Current

Products

AWR Design Environment v. 16 has cross-platform interoperability to support RF to millimeter wave (mmWave) intellectual property integration for heterogeneous technology development across the Cadence Virtuoso design platform as well as the Allegro PCB and IC package design platforms.

Read more: Cadence Announces AWR Design Environment v. 16

TO263-7L package includes BM2SC12xFP2-LBZ AC/DC converter ICs with built-in 1700V SiC MOSFET.

Read more: Rohm Debuts BM2SC12xFP2-LBZ Converter ICs in TO263-7L Package

E3.series suite of products for wire harness and electrical cabinet design now has cloud storage.

Read more: Zuken Announces Cloud Storage for E3.series

Allegro X Design Platform unifies schematic, layout, analysis, design collaboration and data management.

Read more: Cadence Announces Allegro X Electronics CAD Platform

3D Systems added four Figure 4 high-performance, production-capable resins designed for batch-run, end-use part manufacturing, and prototyping applications.

Read more: 3D Systems Adds 4 Figure 4 Resins