I-Cube4 incorporates four HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal management and stable power supply.

Is a 2.5-D heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several high bandwidth memory dies on top of silicon interposer, making multiple dies operate as single chip in one package. Mold-free structure removes heat and conducts pre-screening test that can filter out defective products during fabrication process.

Samsung Electronics
samsung.com/us/

• Prev
• Next