Fujipoly America's CF210A thermal gap filler incorporates carbon fibers along with traditional fillers. Carbon fibers allow for higher thermal conductivity while remaining compliant. Compliance is closer to a much lower conductivity gap filler such as SARCON® PG25A. Has a stable thermal resistance, regardless of compression.

Read more: Fujipoly Releases SARCON CF210A Thermal Gap Filler

Vishay Intertechnology's seven new MOSFET and diode power modules are designed specifically for on-board charger applications.

Offer all the circuit configurations required for AC/DC, DC/DC, and DC/AC conversion in on-board charging applications — input / output bridges, full-bridge inverters, and power factor correction (PFC) — across a wide range of power ratings. Compliant with the AQG-324 automotive guideline and can be combined to provide a complete solution for electric (EV) and hybrid electric (HEV) vehicles, in addition to e-scooters, agricultural equipment, railways, and more.

EMIPAK package can accommodate a range of custom circuit configurations in the same 63mm x 34mm x 12mm footprint, enabling higher power density than utilizing discrete solutions while providing the flexibility to use each module in different power stages for industrial and renewable energy applications, including welding, plasma cutting, UPS, solar inverters, and wind turbines.

Exposed AI2O3 direct bonded copper (DBC) substrate provides improved thermal performance, while optimized layout helps to minimize stray inductance for better EMI performance. PressFit pin locking technology allows for easy PCB mounting and reduces mechanical stress on the substrate, while baseless structure increases reliability by reducing the number of solder interfaces.

Vishay Intertechnology

www.vishay.com