Products

PowerCu soft laser copper ribbons are for laser bonding in power electronic systems.

Read more: Heraeus Introduces PowerCu Soft Laser Copper Ribbons

Condura.ultra Ag-free AMB substrate enables bonding silicon-nitride-based ceramics with copper foils.

Read more: Heraeus Launches Condura.ultra AMB Substrate

ExpressPCB Plus v. 3.1 layout software expands ability to create complex, multipage schematics and fully validate PCB layout.

Read more: ExpressPCB Updates ExpressPCB Plus v. 3.1 Layout Software

CircuitSeed thin, dense film is used as 3-D, finely patterned seed layers for subsequent metallization by plating.

Read more: Electroninks Releases CircuitSeed Film

CircuitWrap ink is used as bezel/wrap electrodes in touch-panel displays and micro/miniLED panels.

Read more: Electroninks Introduces CircuitWrap Ink

CircuitShield ink is for EMI shielding and backend semiconductor metallization.

Read more: Electroninks Offers CircuitShield Ink

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