PowerCu soft laser copper ribbons are for laser bonding in power electronic systems.
Condura.ultra Ag-free AMB substrate enables bonding silicon-nitride-based ceramics with copper foils.
ExpressPCB Plus v. 3.1 layout software expands ability to create complex, multipage schematics and fully validate PCB layout.
CircuitSeed thin, dense film is used as 3-D, finely patterned seed layers for subsequent metallization by plating.
CircuitWrap ink is used as bezel/wrap electrodes in touch-panel displays and micro/miniLED panels.
CircuitShield ink is for EMI shielding and backend semiconductor metallization.