Printed Circuit Design & Fab Online Magazine - Current

Products

ElepguardSL 1303 Nano-AQ-FLZ is a water-borne conformal coating based on acrylate resin with nano filling agents. Is colorless, transparent and fluorescent. Offers the properties of inorganic fillers without inhibiting clarity. The filling agents are said to improve the barrier effect – and thus film density – adhesion and chemical resistance. Is said to have high elasticity and mechanical stability, resist scratches and abrasions, and provide cold flexibility and thermal shock resistance. Meets IPC-CC-830 requirements. Solvent-removable.

Lackwerke Peters, www.peters.de

These lead frames are for a wide variety of applications, including semiconductors, glass-to-metal seals and relays; are also used in medical applications such as hearing aids. Base materials include kovar, nickel-iron alloys, copper alloys and pure nickel; can be plated in entirety or selectively. Pb-free materials include silver, nickel, gold or tin, depending on customer conductivity requirements.

Photofabrication Engineering, www.photofabrication.com

These large, high-complexity PCBs are for use in compute-intensive applications such as servers and mainframes for defense, aerospace and commercial applications. EI reportedly can provide high-density, double-sided hybrid PC board assemblies (SMT/PTH/press fit) with an average component count of > 1500, including high-I/O area array modules (CGA, LGA, PBGA) and dense, high-I/O connectors, in sizes as large as 32" x 44".

Endicott Interconnect Technologies, www.endicottinterconnect.com

PCB12 3.0 design software uses a free distribution model. Is said to extend PCB industrial-grade design environment with a high-throughput user interface; fully defined DRC/DfM rules; real-time order quoting, and 'click-to-order' function. Upgrades include integrated schematic and layout, bidirectional schematic/layout synchronization, schematic auto-wiring, auto-placer and auto-router, and real-time DRC 12 layer board support.

Sunstone Circuits, www.sunstone.com

The MultiPress S is a microprocessor-controlled bench-top multilayer lamination press said to be ideal for creating multilayer circuit boards. Is said to be a tool for rapid PCB prototyping, with a pressing time of fewer than 90 min. Bonds multilayer circuits of all common rigid and flexible substrates. Delivers equal pressure on the full press plate area. Nine heating/pressing/cooling process profiles can be programmed into the system, with a max. press area of 9" x 12" and temp. up to 482 °F (250 °C); can bond RF-multilayer substrates.

LPKF, www.lpkfusa.com

This high-speed robotic palletizing solution uses multiple robotic arms. Enables four-way orientation of cases. With full control of package label positioning, customers reportedly can showcase the same graphics on all four sides of the pallet, or orient barcodes to streamline scanning operations.

FKI Logistex, www.fkilogistex.com