Continuous vertical Desmear electroless copper equipment is said to combine the process quality and production advantages associated with horizontal continuous platers. Said to have easier release of entrapped air and gas; uniform, high-volume delivery gained by the transport of panels past fluid delivery spargers. Advantages are said to include a high-reliability end product; improved 1st pass yield; the ability to process wide range of panel thicknesses without compromise on parameters; low CD strike/semi panel improves copper deposit properties. Process reportedly allows optimized de-smear on various substrates.
Process Automation International Ltd., www.palhk.com
FLO/PCB Version 4.1 thermal design software includes the ability to model potting compounds, probe temperature values interactively, provide user-defined temperature ranges and search component libraries. Is said to make it possible to perform board-level thermal simulation early in the design process. Includes a SmartPart object used to represent epoxy type solid cured potting compounds; can be placed over all or part of either side of the PCB. Multiple potting compound regions reportedly can be defined. Provides the ability to move the cursor over a temperature plot in the results visualization mode and report the point temperature. Using legend scaling options, users can define minimum and maximum values for the upper and lower bounds of the scale. Also includes an advanced search capability. Maintains bi-directional connectivity with Version 7.1 of Flotherm.
SIP and STRIP male pin headers feature sturdy 0.040" diameter leads; mate to standard SIP and STRIP female sockets. The double-row connector is offered standard in 8 (2x4) up to 100 (2x50) position configurations on 0.100" spacing. Reportedly creates a high current interconnect rated at 8 amps per position. The low-profile insulator (0.071" thick) is manufactured with high-temperature thermoplastic. Standard and RoHS plating available. Use brass alloy 360 ½ hard.
Extreme-duty 99-840 finger stock is an EMI shielding gasket engineered for large enclosures that have significant gap fluctuations between mating surfaces. Low compression force. Said to provide deflection range of 0.25" (6.4 mm) and installs on most enclosure panels with a clip-on lance. Optional “C” style retaining lance is available. Can be ordered in 10 surface finish and plating options.
StatNot XC is a static dissipative material that can be combined with existing materials, such as the NP510A fiberglass epoxy composite. The composite surface is said to maintain a surface resistivity of 106 to 109 ohms per sq. Said to be ideal for applications in the electronics assembly market, such as test fixtures and assembly work surfaces. Is tested and certified to a surface resistivity range of 105 to 1010 ohms per sq.
PCB Artist software is a free layout package that includes schematic symbol, footprint and part creation wizards to streamline the PCB design process and reportedly reduce component creation time to as little as five minutes. Customers can draw from an extensive library of components. Includes automated component placement and trace routing; back-and-forward integration that permits users to make changes to the schematic that automatically translate to the PCB design. Gerber-formatted files available on request.