Printed Circuit Design & Fab Online Magazine - Current

Products

Rogers Corporation introduces an online tool to support the PORON gap fill product line. The tool helps designers select the best PORON Urethane to meet their specific application needs.

The PORON Gap Filling Tool is an interactive tool that designers can customize to help select the right material to meet final gap thickness requirements. Designers can select a final gap thickness and optional adhesive thickness from a drop-down menu and get a list of suitable PORON materials for their specific application.

Designers select one or more of the PORON products to create a custom compression force deflection graph. This graph enables the user to "mouse-over" product curves to show actual compression force and final thickness values along any point on the curve.

www.rogerscorp.com

The NanoBond bonding material manufactured by Reactive NanoTechnologies, Inc. (RNT) has exceeded testing through 1000 thermal cycles with no degradation in thermal performance or bond strength.

The product was tested at -40ºC to +110ºC, per IEC 62108, Test 10.6. Testing at 110ºC typically concludes at 500 cycles, but the testing was continued through 1000 cycles. Thermal conductivity was measured by laser flash technique.

NanoBond is used to bond microelectronic and photovoltaic components to PCBs or heat sinks at room temperature.

www.rntfoil.com

The PicoStar package from Texas Instruments uses up to 80% less board space. According to TI this ultra-thin package is the first to give system designers the option to embed silicon components inside the PCB to decrease the board space used for EDS protection.

The TPD2E007 is a two-channel electrostatic discharge (ESD) solution with a back-to-back diode array that allows AC-coupled data transmission without compromising signal integrity. Designers have the option to surface mount or embed the TPD2E007 into the board/connector for ESD protection. The ability to embed this device can save up to 80% board space compared to typical ESD solutions.

www.ti.com/tpd2e007-pr

Ecliptek Corp. introduces IPC-1752-2, an automated one-step process for IPC-1752. The company has added second-level interconnect terminal plating material composition information for its crystal resonator and quartz crystal oscillator product lines.

Available through Ecliptek’s online RoHS tool, customers are able to enter a part number and to generate a product series IPC-1752-2 material composition declaration.

The IPC-1752-2 generates RoHS certification based on a specific part number and is designed to automatically provide certifications and material declarations on available Ecliptek RoHS-compliant equivalent part numbers.

www.ecliptek.com

Leader Tech Inc. introduces FerriShield Ferrites. The product is designed to remove unwanted high-frequency interference signals for applications with a peak frequency of 2.45 GHz.

The multiple cable-mounted ferrites are available in several bisected and solid styles and can accommodate many round, flat or bundled cable applications.

www.leadertechinc.com

Fujipoly introduces GR-H and XR-H, gap fillers. The thermal interface materials have a unique hardened top surface. The company reports that the thermal pad adheres to the electrical component or opposing heat sink and can easily release during disassembly for re-work or repair, preventing damage and tearing.

The products are available in eight formulations, offering thermal conductivity from 1.2 W/m°K to 17.0 W/m°K. Thicknesses range from 0.5 mm to 5.0 mm, with a maximum dimension of 200 mm by 300 mm. The material easily conforms to uneven components and makes a complete thermal transfer contact.

www.fujipoly.com